AluminaPrep I, ALUMINA SUSPENSIONS, Sol-Gel 

AluminaPrep I, 8.5pH, Excellent for minerals, ferrous metals, low melting point alloys, carbides, PCBs, precious metals and electronics.

AluminaPrep II, ALUMINA SUSPENSIONS, Agglomerated

AluminaPrep II, Neutral, Agglomerated alumina suspensions offer higher removal rates than other alumina suspensions of the same size. Excellent for lead, magnesium and their alloys.

SilicaPrep, SILICA SUSPENSIONS, Colloidal 

SilicaPrep, Silica oxide suspensions, 9.5pH, Used for chemical/mechanical polishing on metals, minerals, ceramics, glass, sapphires, semi-conductors, microelectronics 

and polymers.

Al-SiPrep, BLEND SUSPENSIONS OF ALUMINA AND COLLIDAL SILICA, Al + Si

Al-SiPrep, Blend of alumina and colloidal silica, 0.05µm, 9pH. The colloidal silica provides a chemical polishing action, whereas, the polycrystalline alumina provides a mechanical polishing action. Especially suitable for final polishing of steel, aluminum alloys, electronic materials.

CeriumPrep, CERIUM OXIDE SUSPENSIONS, Colloidal 

CeriumPrep, For fine polishing of materials such as semiconductors, integrated circuits, optical lenses, fiber optic connectors, glass-ceramic substrates and crystal surfaces. 

ULTRAPOLISH Series